Copper-clad MC4 unsaturated polyester resin
US5312691A · kind A · utility
5Cited by
11References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 10, 1991 |
| Grant date | May 17, 1994 |
| Priority date | — |
| Expiry date | Sep 10, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/3423
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Metal foil laminates of an unsaturated polyester resin, MC4, characterized by high performance electrical, physical and mechanical properties and useful for electronic circuit boards, low impedence microwave boards and E.M.I.-R.F.I. shielding, and a process for preparing such a metal-clad laminate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.