Circuit board for high pin count surface mount pin grid arrays
US5313021A · kind A · utility
29Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 1992 |
| Grant date | May 17, 1994 |
| Priority date | — |
| Expiry date | Sep 18, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board is provided with surface mount pads for soldering a surface mount pin grid array package. The printed circuit board is laminated with one or more solder mask layers containing apertures therein to expose the surface mount pad locations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.