Semiconductor memory control device and method of mounting same in high density
US5313416A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 1, 1992 |
| Grant date | May 17, 1994 |
| Priority date | — |
| Expiry date | Jul 1, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A semiconductor memory control device includes a flexible circuit board having a plurality of panels and folded so that the panels are stacked on one another, a plurality of semiconductor elements mounted on the flexible circuit board, and a package enclosing the flexible circuit board and the plurality of semiconductor elements. A method of mounting semiconductor memory control devices in high density includes mounting a plurality of semiconductor elements on a flexible circuit board, forming an internally mounted module by folding the flexible circuit board in panels that are stacked in multiple layers, and enclosing the internally mounted module in a package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.