Assembly and testing of electronic power components insulation
US5313701A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 30, 1992 |
| Grant date | May 24, 1994 |
| Priority date | — |
| Expiry date | Jul 30, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In accordance with a method for assembly and testing the insulation of power components for electronic switching and control devices, particularly for motor vehicles, the power components are fastened to a heat sink so as to be thermally conducting and electrically insulated and are connected together with additional component elements on a printed circuit board and with a circuit ground. In order to protect voltage-sensitive component elements on the printed circuit board, the heat sink is first fastened to the printed circuit board without potential and then the insulation between the heat sink and power component is tested by applying high voltage between the heat sink and power component, and the heat sink is finally electrically connected with the circuit ground.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.