Highly rigid composite shaped abrasive cutting wheel
US5313742A · kind A · utility
25Cited by
10References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 11, 1991 |
| Grant date | May 24, 1994 |
| Priority date | — |
| Expiry date | Jan 11, 2011 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D5/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A cutting wheel, especially suitable for dicing silicon wafers and the like, which has a high degree of stiffness as a result of the wheel being a monolith with a thick inner section and thin outer or cutting section.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.