Die adhesion testing method and apparatus
US5313841A · kind A · utility
8Cited by
2References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 9, 1992 |
| Grant date | May 24, 1994 |
| Priority date | — |
| Expiry date | Jul 9, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L22/12
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A connector assembly for connecting to a chip and a substrate for testing the bond between a chip and a substrate in a testing apparatus, the connector assembly comprises a pair of connector blocks, each block having a generally square planar connecting face for bonding to oppositely directed faces of a chip and substrate, and a coupling end for mounting in a tensile testing machine, and a swivel connector assembly for connecting to the coupling and mounting in a tensile testing machine for the application of aligned tension to the chip and substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.