Process for forming silicon oxide film
US5314724A · kind A · utility
Assignees
Inventors
Key dates
| Filing date | Aug 27, 1992 |
| Grant date | May 24, 1994 |
| Priority date | — |
| Expiry date | Aug 27, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02274
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for the formation of a silicon oxide film, comprising the steps of exciting a gas comprising an organosilane or organosiloxane gas and a gas containing H and OH above a substrate in a reaction chamber to react them with each other in a gaseous phase or on the substrate, thereby depositing a thin film of an organic-group-containing silanol, silanol polymer, or siloxane-bonded polymer on the substrate, and removing the organic groups from the thin film to form a silicon oxide film. Preferably, the formation of a film is conducted while repeating the step of deposition and the step of removing the organic groups through a plasma treatment within an identical chamber, and the film is further heat-treated at a temperature of 450.degree. C. or below. Thus, a good insulating film having a flatness comparable to that of an SOG film can be obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.