Room temperature curable organopolysiloxane composition and cured product of the same
US5314981A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 26, 1993 |
| Grant date | May 24, 1994 |
| Priority date | — |
| Expiry date | Mar 26, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G77/70
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A room temperature curable organopolysiloxane composition comprising: (A) 100 parts by weight of a diorganopolysiloxane blocked by hydroxyl group at both terminal ends of its molecule, (B) from 0.5 to 30 parts by weight of an organosilicon compound having at least three silicon-bonded hydrolyzable groups in its molecule or a partially hydrolyzed product of the organosilicon compound, (C) from 0.1 to 15 parts by weight of an alkoxysilane having the following general formula (1): ##STR1## wherein R.sup.1 and R.sup.2 are each an unsubstituted or substituted monovalent hydrocarbon group of from 1 to 8 carbon atoms, R.sup.3 is a divalent hydrocarbon group of from 1 to 8 carbon atoms which may contain an amide linkage (--CONH--) or ether oxygen linkage, Rf is a divalent perfluoroalkylene group or a divalent perfluoropolyether group, and n is an integer from 1 to 3, and a cured product of the composition. The composition and the cured product thereof ensure lessened contamination on surfaces of the cured product and in the surroundings, and permit easy removal of fungi, if any, from surfaces of the cured product.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.