Wirecut electrical discharge machine utilizing silicon powder suspended in a dielectric material
US5315087A · kind A · utility
9Cited by
8References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 2, 1992 |
| Grant date | May 24, 1994 |
| Priority date | — |
| Expiry date | Mar 2, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23H7/34
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wirecut electrical discharge machining apparatus having silicon particles suspended in a dielectric solution that fills the machining gap. The silicon particles may be suspended in the dielectric solution prior to a machining operation or they may be mixed with the dielectric solution directly in the machining gap. Also, a silicon-coated electrode may be utilized. The silicon overcomes many of the limitations associated with conventional dielectric solutions, by allowing more uniformity of conductivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.