Semiconductor laser module with lens holder compensating for thermal stress
US5315609A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 30, 1992 |
| Grant date | May 24, 1994 |
| Priority date | — |
| Expiry date | Oct 30, 2012 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4204
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A semiconductor laser module is provided by silver soldering the holder part of Kovar to the package of Kovar, and then silver soldering the lens holder part of pure iron or a stainless steel to the holder part. The lens holder part has the convergent rod lens fixedly soldered thereto by an Au/Sn solder of a high melting point of 280.degree. C. The semiconductor laser is fixedly soldered onto a stem, with the stem, the optical fiber and ferrule holder being fixedly soldered at positions so that the light emitted from the semiconductor laser is converged by the convergent rod lens at the light incidence end of the optical fiber and the laser light is coupled to the optical fiber. Thus, the convergent rod lens can be fixed with high-melting-point joining means, and a semiconductor laser module for optical communications in which the deterioration of light connection repeatedly generated by heat stress is suppressed can be obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.