Patent · US Expired

Modular thermoelectric assembly

US5315830A · kind A · utility

100Cited by
5References
21Claims
0Family size

Assignee

Inventors

Key dates

Filing dateApr 14, 1993
Grant dateMay 31, 1994
Priority date
Expiry dateApr 14, 2013

Classification

  • Technology area (CPC F)Mechanical Engineering; Lighting; Heating
  • CPC primaryF25D2400/40
  • WIPO fieldOther consumer goods
  • WIPO sectorOther fields

Abstract

A modular thermoelectric assembly is provided to maintain the temperature within a container or enclosed structure at a desired level. The thermoelectric assembly includes a thermoelectric device with a hot sink and a cold sink. A layer of insulating material is disposed between the hot sink and the cold sink. The hot sink and the insulating material are used to install the thermoelectric assembly into an appropriately sized opening extending through the exterior of the container or enclosed structure. A thermoelectric device, contained within the layer of insulating material, functions as a heat pump to transfer heat between the cold sink and the hot sink. An electrical motor, rotating shaft and propellers are carried by the assembly to assist in the circulation of air to improve the efficiency of the cold sink and the hot sink.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.