Oscillation device for plating system
US5316642A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 22, 1993 |
| Grant date | May 31, 1994 |
| Priority date | — |
| Expiry date | Apr 22, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S204/05
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of and an apparatus for the electroplating of material onto substrates, such as computer memory disks, by use of a plating cell comprising cathodes, anodes, passive shields, filters, an oscillation system and an electrical power supply. Anodes and magnets are attached to the inside side walls of the plating cell. The magnets have a coating of an electrically non-conducting material covering it. Shields, each having a filter attached to it, are also fixed to the inside side walls. A pallet, having openings for holding disk substrates during electroplating, is placed between the shields in the plating cell. The disk substrates function as cathodes during electrolytic plating. The anodes and cathodes when electrically energized results in deposition of desired material, having uniform thickness, across the entire surface area of the substrate. The shields and the coated magnets function as current shields that control the flow of ions within the plating cell and thereby ensure uniformity of plating thickness at the substrate surface. The magnet also provides a radial flux pattern at the surface of the substrate to orient the deposit on the substrate surface. The oscillation s…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.