Mold releasing resin composition and molding of curable resin using the same
US5316716A · kind A · utility
9Cited by
15References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 1992 |
| Grant date | May 31, 1994 |
| Priority date | — |
| Expiry date | Jun 12, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2083/00
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A mold releasing resin composition is provided which contains at least one fluorinated compound end-blocked with a dimethylhydrogensiloxane group and optionally having a fluorinated polyether linkage. The composition is applied to the inner surface of a silicone rubber mold and cured thereat before a curable resin is admitted into the mold, cured therein, and then removed from the mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.