Method for forming electrical interconnections in laminated vias
US5316803A · kind A · utility
16Cited by
27References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 10, 1992 |
| Grant date | May 31, 1994 |
| Priority date | — |
| Expiry date | Dec 10, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49224
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for forming electrical interconnections in vias is provided by laser drilling vias in a composite that contains at least two circuitized organic polymeric substrates superimposed upon each other. The laser drilling causes metallic circuit lines contained within each substrate to melt and form a fused mass protruding a short distance out of the side of the drilled vias. Next, the drilled vias are plated with a conductive metal to thereby provide the interconnections.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.