Patent · US Expired

Syndiotactic hot melt adhesive

US5317070A · kind A · utility

45Cited by
5References
21Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 25, 1992
Grant dateMay 31, 1994
Priority date
Expiry dateAug 25, 2012

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08L2666/02
  • WIPO fieldBasic materials chemistry
  • WIPO sectorChemistry

Abstract

A hot melt adhesive including syndiotactic polypropylene having a polymer chain of at least 80% racemic dyads and having a melting point of about 100.degree. C. to 180.degree. C.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.