Patent · US Expired

Photolithographic fabrication of luminescent images on porous silicon structures

US5318676A · kind A · utility

26Cited by
5References
22Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 22, 1992
Grant dateJun 7, 1994
Priority date
Expiry dateJun 22, 2012

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC25F3/12
  • WIPO fieldSurface technology, coating
  • WIPO sectorChemistry

Abstract

A polished wafer of single-crystal silicon (Si) is ohmically contacted on its backside to a copper wire to provide a working electrode. The wafer and a counterelectrode are immersed in a solution of aqueous HF and ethanol within an optical quality cuvette. Lithographic images are projected onto the silicon wafer within the solution, and the wafer is etched galvanostatically at a low current density until a predetermined charge density is attained. The areas of an n-type silicon wafer exposed to the light during the etch will exhibit visible luminescence when the wafer is illuminated with an ultraviolet (UV) lamp or other short wavelength visible light. The areas of the wafer that were not exposed to the pattern during etch will not luminesce.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.