Process for forming alloys in situ in absence of liquid-phase sintering
US5318746A · kind A · utility
57Cited by
18References
16Claims
0Family size
Assignee
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Key dates
| Filing date | Dec 4, 1991 |
| Grant date | Jun 7, 1994 |
| Priority date | — |
| Expiry date | Dec 4, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S75/955
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
Oxide-free metallic, alloy or intermetallic compound formed by coating a powder of at least one member selected from the group consisting of elemental metallic, alloy and intermetallic compound with an oxide-replacing metal. The oxide-free compound may be compacted without the addition of a liquid sintering agent and at temperatures below the melting point of the compound, under sufficient pressure to form a uniform, consolidated intermetallic body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.