Conditioning of a substrate for electroless plating thereon
US5318803A · kind A · utility
27Cited by
19References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 13, 1990 |
| Grant date | Jun 7, 1994 |
| Priority date | — |
| Expiry date | Nov 13, 2010 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/28
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A dielectric substrate is conditioned for subsequent electroless plating thereon by contacting with a catalytic metal salt and then with a reducing agent and with an electroless metal plating bath followed by contacting with a second catalytic metal salt. In addition, a dielectric substrate is conditioned for electroless plating thereon by obtaining a substrate of a dielectric material that contains metal particles therein and contacting with a catalytic metal salt.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.