Printed circuit board for an injection molding apparatus
US5320513A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 10, 1992 |
| Grant date | Jun 14, 1994 |
| Priority date | — |
| Expiry date | Dec 10, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/2751
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
An injection molding station includes a mold manifold plate housing a plurality of injection molding nozzles and housing heaters for the plurality of injection molding nozzles; at least one printed circuit board associated with the mold manifold plate; and a power source; wherein the at least one printed circuit board electrically connects the power source with the heaters. Each printed circuit board has at least one power layer printed with a plurality of power supply tracks, the power supply tracks being connected at a first end to the power source and at a second end to a respective heater. Each nozzle may also have a respective temperature sensing device, the printed circuit board having at least one sensor layer printed with sensor tracks, the sensor tracks being connected at a first end to a respective temperature sensing device, and at a second end to a controlling device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.