Combination of aqueous baths for electroless gold deposition

US5320667A · kind A · utility

Assignee

• Atotech Deutschland GmbH & Co. KG · DE

Inventors

• Renate Gesemann · Chemnitz, DE
• Jurgen Spindler · Regensburg, DE
• Falk Richter · Geringswalde, DE
• Renate Broulik · Geringswalde, DE
• Klaus Janotta · Berlin, DE
• Robert Rüther · Hemmingen, DE
• Manfred Dettke · Berlin, DE

Key dates

• Filing date: Mar 25, 1993
• Grant date: Jun 14, 1994
• Expiry date: Mar 25, 2013

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

The invention relates to a combination of aqueous baths for electroless gold deposition and, preferably, for the deposition of gold onto nickel and nickel alloy films. The combination consists of a preliminary bath and a primary bath and, optionally, a pickling solution and a pretreatment. The gold film which is obtained is chip-bondable and wire-bondable.