Process for molding utilizing compression sleeve
US5320700A · kind A · utility
16Cited by
29References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 15, 1991 |
| Grant date | Jun 14, 1994 |
| Priority date | — |
| Expiry date | Apr 15, 2011 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29K2105/101
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A high temperature film wrapping is used to wrap thermoplastic materials before they are molded. The thermoplastic material can then be molded by applying heat and pressure and the resulting thermoplastic material will contain reduced cracks and voids compared with thermoplastic materials molded without the wrapping.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.