Heat-resistant resin composition
US5321097A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 30, 1993 |
| Grant date | Jun 14, 1994 |
| Priority date | — |
| Expiry date | Apr 30, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L81/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A heat-resistant resin composition comprising a melt-kneaded product of: PA1 (A) at least one member selected from the group consisting of a polyamideimide resin precursor composed mainly of a recurring unit of the formula (1)-a, ##STR1## wherein R is a divalent aromatic group or aliphatic group, R.sup.1 is a hydrogen atom, an alkyl group or a phenyl group, and Ar is a trivalent aromatic group composed of at least one six-membered ring, and a polyamideimide resin composed mainly of a recurring unit of the formula (1)-b, ##STR2## wherein R, R.sup.1 and Ar are as defined in the above formula (1)-a, (B) a polyphenylene sulfide resin, and PA1 (C) an organic isocyanate compound having at least two isocyanate groups in the molecule, the amount of said organic isocyanate compound being 0.5 to 5 parts by weight based on 100 parts by weight of the total amount of the compounds (A) and (B).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.