Semiconductor device having linearly arranged semiconductor chips
US5321303A · kind A · utility
26Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 17, 1992 |
| Grant date | Jun 14, 1994 |
| Priority date | — |
| Expiry date | Apr 17, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3043
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method for manufacturing a semiconductor device using inclined stage of a dicing saw in order to cut the semiconductor substrate obliquely with respect to the depthwise direction. When a plurality of semiconductor chips diced obliquely are connected, a degree of connecting accuracy is increased, and it is possible to realize a contact-type image sensor of high resolving power and high accuracy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.