Low profile printed circuit board
US5321380A · kind A · utility
40Cited by
8References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 1992 |
| Grant date | Jun 14, 1994 |
| Priority date | — |
| Expiry date | Nov 6, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1476
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a low-profile printed circuit board including a substrate having at least one planar magnetic element supported thereon. The element includes a planar winding integral with the conductive circuit formed on either one or the other side of the board, and electrical communication is made from one side of the board to the other side via plated through holes provided in the substrate. Additional planar windings may be surface mounted to the winding carried by the substrate. A dielectric coating is also provided which completely isolates the winding of the planar magnetic element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.