Universal carrier supported thin copper line
US5322975A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 1992 |
| Grant date | Jun 21, 1994 |
| Priority date | — |
| Expiry date | Sep 18, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12903
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An easily peelable or chemically strippable laminate and method of making same comprising an aluminum carrier, an aluminum oxide layer, which is at least 800 Angstroms thick and deposited on the aluminum carrier, copper foil electrodeposited on the aluminum oxide layer and optionally, a brass layer electrodeposited on the copper foil have been discovered. Such laminates find utility in the electronics industry in the fabrication of printed circuit boards and afford an ease of strippability of the protective aluminum carrier-aluminum oxide layer heretofore unknown in the industry. The protective aluminum carrier-aluminum oxide layer of the laminates of the present invention may also be chemically etched away providing a universal carrier for copper foil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.