Process for forming polyimide-metal laminates
US5322976A · kind A · utility
22Cited by
4References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1991 |
| Grant date | Jun 21, 1994 |
| Priority date | — |
| Expiry date | Nov 18, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S205/926
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Polyetherimide-metal laminates are formed by etching the surfaces of a polyetherimide web with a glycol-containing etchant followed by electroless nickel or cobalt deposition and then by copper deposition. The glycol-containing etchant can be utilized to form through holes through the web.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.