EMI internal shield apparatus and methods
US5323299A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 31, 1993 |
| Grant date | Jun 21, 1994 |
| Priority date | — |
| Expiry date | Mar 31, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K9/0039
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An EMI internal shield made of an electrically conductive material that absorbs and reflects electromagnetic interference (EMI) signals associated to fit with an EMI shield top cover. The EMI internal shield is formed to fit without solder or welding as an EMI shield apparatus over EMI susceptible electronic circuitry on a printed circuit board. The EMI internal shield apparatus not only shields circuitry from EMI sources external to the printed circuit board, but also isolates certain electronic circuits from other electronic circuitry on the printed circuit board. Additionally, the EMI internal shield permits the communication of desired electromagnetic radio frequency and electrical signals to the circuitry inside the shield. The EMI internal shield apparatus includes the use of an electrically conductive layer that is integral to the top of the printed circuit board and which includes conductive channels that penetrate the printed circuit board. The channels prevent EMI from passing through the printed circuit board to the shielded electronic circuits. Also, the channels receive tangs found on the EMI internal shield. The tangs are positioned to prevent EMI from passing through…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.