Dry etching method and dry etching apparatus
US5324388A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 11, 1993 |
| Grant date | Jun 28, 1994 |
| Priority date | — |
| Expiry date | Jun 11, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/32678
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Magnetic coils are provided around a plasma generation chamber. To the plasma generation chamber is supplied a microwave which is generated by a microwave generator. Electron cyclotron resonance is caused by the interaction between a magnetic field produced by the magnetic coils and the microwave generated by the microwave generator, so as to accelerate electrons in the plasma generation chamber. The electrons thus accelerated generates a plasma. A reaction chamber is provided underneath the plasma generation chamber. The plasma generated in the plasma generation chamber is introduced to the reaction chamber to be used for etching a material on a sample stage. A reflex klystron is used as the microwave generator. By changing the cavity length of the reflex klystron, the resonance frequency of the cavity resonator is varied, thus modulating the frequency of the microwave supplied to the plasma generation chamber by the microwave generator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.