Electrode preconditioning method for a plating bath monitoring process
US5324400A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 1992 |
| Grant date | Jun 28, 1994 |
| Priority date | — |
| Expiry date | Dec 4, 2012 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N27/38
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of preconditioning an electrode for use in a plating bath monitoring process. The method involves applying at least one anodic signal to an electrode in contact with the plating bath solution in order to yield a reproducibly clean and stabilized electrode surface, and then applying a plating signal to deposit a layer of metal on the anodically treated electrode. The resultant preconditioned electrode improves the accuracy and precision of subsequent voltammetric monitoring measurements for a variety of different plating baths. The method is easily integrated with and thereby enhances the capabilities of known voltammetric plating bath monitoring processes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.