Poly(vinyl chloride) compositions exhibiting increased adhesivity to polyamide and multi-layer structures comprising the same
US5324588A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 10, 1990 |
| Grant date | Jun 28, 1994 |
| Priority date | — |
| Expiry date | Sep 10, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/3192
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Improved poly(vinyl chloride) compositions which exhibit improved adhesivity to polyamide which find particular utility in the construction of multi-layer structures, particularly for the fabrication of improved structures for use in forming electrical insulation structures for wires and cables. In one useful embodiment, the multi-layer structure has in the following order: a layer of PVC and a layer of polyamide in contact with the layer of PVC wherein the layer of PVC includes a vinyl chloride containing copolymer or a terpolymer which exhibits good solubility with the PVC, and which further provides good adhesivity with the PA. The vinyl resin is selected from the group consisting of vinyl chloride-vinyl acetate-vinyl alcohol terpolymers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.