Method for manufacturing printed circuit board
US5325583A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 1992 |
| Grant date | Jul 5, 1994 |
| Priority date | — |
| Expiry date | Oct 8, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/109
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
There is disclosed a method for manufacturing a printed circuit board in which fine copper circuit patterns are transferred onto a thermoplastic resin, without producing a large amount of waste liquors in which copper is dissolved unlike in a subtract method. The method for manufacturing a printed circuit board includes the steps of manufacturing a printed circuit original plate having protruding patterns which have the same shape as circuit patterns to be formed and a height at least the same as the thickness of a copper foil used and each of which is constituted by a flat or projecting curved surface to be brought into contact with the copper foil and side surfaces different from the flat or projecting curved surface, and heating under pressure the protruding patterns of the original plate against a thermoplastic resin with the copper foil interposed therebetween to transfer portions of the copper foil in contact with the protruding patterns onto the surface of the thermoplastic resin, thereby forming the circuit patterns.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.