Wire bonder tail length monitor
US5326015A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 1993 |
| Grant date | Jul 5, 1994 |
| Priority date | — |
| Expiry date | Mar 29, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus for monitoring the length of a fine wire tail made after the second bond of a fine wire interconnection includes a continuity circuit and a wire bond monitoring system (WBMS) in an automatic wire bonder. The Z axis position of the bonding tool is sensed to determined the height of the bonding tool on second bond and at the time the fine wire breaks from second bond. The monitoring circuit determines if the wire clamps are initiated and when and if the electronic flame-off control is fired. Logic circuit in the WBMS determine if wire tail after second bond is of a proper length to make a ball on the wire tail and if not, what remedial measures must be made to avoid damage to the semiconductor device being bonded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.