Method for making electrostatic RF absorbant circuit carrier assembly
US5326414A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 25, 1992 |
| Grant date | Jul 5, 1994 |
| Priority date | — |
| Expiry date | Jun 25, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49126
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electrostatic RF absorbant circuit carrier assembly production method including the steps of forming a polymeric support structure having a base and surrounding walls which form an internal cavity from plastic, disposing a plurality of conductor paths within the cavity, forming a polymeric cover having wall members integrally fashioned into a surface thereof, for making contact with conductor paths within the cavity, depositing a layer of surface material on the cover and the cover wall members, said surface material comprising: PA1 a thermosetting binder, PA1 a non-conductive RF absorbing filler comprising 25 to 87 percent by weight loading of the binder, such that the surface material absorbs RF energy within a range of 1-60 GHz, and PA1 a conductive filler comprising 1 to 4 percent by weight loading of the binder and the RF absorbing filler, such that the surface material has a surface resistivity of 10.sup.5 -10.sup.12 ohms/square, and fixing the polymeric cover to the polymeric support structure to cover the cavity and provide said contact between the wall members and the conductive paths, thereby forming a circuit carrier assembly.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.