Heat-curable molding material

US5326822A · kind A · utility

Assignee

• BASF SE

Inventors

• Anton Hesse · Weinheim, DE
• Walter Heckmann · Weinheim, DE
• Harald Kroeger · Schifferstadt, DE
• Bernd Lothar Marczinke · Frankfurt, DE
• Volker Warzelhan · Bad Dürkheim, DE

Key dates

• Filing date: Jun 26, 1992
• Grant date: Jul 5, 1994
• Expiry date: Jun 26, 2012

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S525/921
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

A heat-curable molding material consists of an unsaturated polyester, monomers, a propylene polymer, free radical initiators and conventional additives and assistants, the propylene polymer being dispersed in the form of solid, round particles having a smooth surface and a mean diameter of from 1 to 200 .mu.m in the polyester resin.