Molding materials based on unsaturated copolyamides

US5326850A · kind A · utility

Assignee

• BASF SE

Inventors

• Walter Goetz · Ludwigshafen, DE
• Brigitte Gareiss · Grünstadt, DE
• Andreas Deckers · Flomborn, DE
• Petra Baierweck · Schifferstadt, DE

Key dates

• Filing date: Mar 3, 1993
• Grant date: Jul 5, 1994
• Expiry date: Mar 3, 2013

Classification

• Technology area (CPC C): Chemistry; Metallurgy
• CPC primary: C08L77/00
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

Molding materials are composed of PA1 A) from 40 to 100% by weight of a copolyamide based on PA2 a.sub.1) from 1 to 20 mol%, based on the copoly- amide, of at least one monomer that contains at least one olefinic double bond (monomers a.sub.1) from the group of the PA3 .alpha..sub.1) olefinically unsaturated lactams, PA3 .alpha..sub.2) olefinically unsaturated aminocarboxylic acids, PA3 .alpha..sub.3) olefinically unsaturated dicarboxylic acids, PA3 .alpha..sub.4) olefinically unsaturated diamines, and PA2 a2) from 80 to 99 mol%, based on the copolyamide, of at least one monomer that contains no olefinic double bonds (monomers a2) from the group of the PA3 .beta..sub.1) lactams PA3 .beta..sub.2) aminocarboxylic acids, PA3 .beta..sub.3) dicarboxylic acids, PA3 .beta..sub.4) diamines, and PA1 B) from 0 to 35% by weight of an impact modifying rubber, PA1 C) from 0 to 50% by weight of a filler and/or reinforcing agent, PA1 D) from 0 to 20% by weight of a flame retardant, and PA1 E) from 0 to 10% by weight of further additives and processing aids.