Seamless holographic transfer
US5327825A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 12, 1993 |
| Grant date | Jul 12, 1994 |
| Priority date | — |
| Expiry date | May 12, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03H2001/0296
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A method of making a die and the die itself for establishing through embossing or micro-embossing a seamless pattern, preferably a holographic pattern, on a decorative medium such as a metallized film is provided. A cylindrical embossing or micro-embossing die is provided with a layer of an embossable material, preferably pure silver, a silver alloy or any other suitable embossable material. The cylindrical die is an integral member in which a pattern is recombined thereon by a step and repeat embossing or micro-embossing process as opposed an intricate lathe-type machine-turning operation, and can thus accept, carry and maintain complex patterns with the integrity required for producing a repeating holographic pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.