Sputtering apparatus and process for forming lamination film employing the apparatus
US5328583A · kind A · utility
14Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 3, 1992 |
| Grant date | Jul 12, 1994 |
| Priority date | — |
| Expiry date | Nov 3, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3426
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A sputtering apparatus comprises at least one pair of first sputtering targets arranged in counterposition; a second sputtering target provided substantially on a concentric circle having the center axis of the first sputtering targets; and a substrate holder for holding a substrate to be coated with particles of target materials emitted from the first sputtering targets and the second sputtering target, which is provided substantially on another concentric circle having the center axis outside the second sputtering target.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.