Methods and apparatus for treating electroless plating baths
US5328616A · kind A · utility
17Cited by
4References
27Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 1993 |
| Grant date | Jul 12, 1994 |
| Priority date | — |
| Expiry date | Mar 9, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC02F2101/20
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Apparatus and methods for removing formate ions from electroless metal plating baths employing formaldehyde as a reducing agent and typically comprising polyvalent anions as metal chelant and/or counterion. The apparatus and methods employ anion filtration to separate polyvalent anions from monovalent formate ions and ion exchange units to remove metal and metal chelant species from formate-containing streams. Preferred aspects of this invention provide apparatus and methods for removing formate from electroless copper plating baths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.