Flexible printed circuits
US5328750A · kind A · utility
2Cited by
7References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 19, 1991 |
| Grant date | Jul 12, 1994 |
| Priority date | — |
| Expiry date | Dec 19, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31935
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Flexible printed circuits comprising copper circuitry electrolessly deposited on an activated ink coating prepared by heating a wet ink comprising a polymer, e.g. polyvinyl chloride or a butadiene polymer, and a Group 1B or 8 compound, e.g. palladium dichloride, which is adapted to drying at room temperature to a catalytically inert ink. Selective areas of the ink activated by application of heat or light, e.g. a laser, are catalytic to electroless deposition of copper.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.