Thermoplastic copolyimides and composites therefrom
US5328979A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 1992 |
| Grant date | Jul 12, 1994 |
| Priority date | — |
| Expiry date | Nov 16, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2969
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Copolyimide compositions and methods for their preparation which are melt-processible at relative low pressures, i.e. less than 1000 psi, and are suited for laminating and molding, are described. The invention additionally encompasses copolyimide precursors, reinforced polyimide composites and laminates made from said polyimides where the composite is reinforced by fibrous materials. This is achieved by reacting at least one aromatic dianhydride where each anhydride group is located on an aromatic ring with the carbonyl units in an ortho orientation relative to one another, with at least one diamine which is capable of a transmidization reaction upon incorporation into the polyimide backbone, and with at least one other diamine which is not capable of undergoing such reaction, the diamine which is capable of undergoing the transimidization reaction being present in an amount of from about 1-50 mole percent in relation to the diamine that is not susceptable to transimidization.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.