High-density packaging for multiple removable electronics subassemblies
US5329428A · kind A · utility
70Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 21, 1993 |
| Grant date | Jul 12, 1994 |
| Priority date | — |
| Expiry date | Jun 21, 2013 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4246
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Packaging for an electronics assembly. A base card has a row of elongated slots. A number of individually insertable subassemblies have standoff feet and a pair of offset hooks at their sides. The hooks snap into the slots in such a way that each slot can hold the hooks for four different subassemblies, which are positioned adjacent each other and on both sides of the base card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.