Two-dimensional array ultrasonic transducers
US5329496A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 16, 1992 |
| Grant date | Jul 12, 1994 |
| Priority date | — |
| Expiry date | Oct 16, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/874
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A piezoelectric transducer chip comprising a plurality of transducer elements arranged in a two-dimensional array is disclosed. At least one of the transducer elements is a multi-layer element which comprises a plurality of piezoelectric layers, each of which is separated from the adjacent piezoelectric layers by an electrode layer so that a plurality of capacitive elements is electrically connected in parallel. A first via connects a first set of alternating electrode layers, and a second via connects a second set of alternating electrode layers. The first via is insulated from the second set of alternating electrode layers, and the second via is insulated from the first set of alternating electrode layers. At least one of the plurality of multi-layer elements has an internal edge. At least one of the vias of a multi-layer element is an internal via. Also disclosed are an ultrasonic transducer which includes such a piezoelectric chip, and an ultrasonic scanner which includes such a transducer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.