Electrical contact containing a braze diffusion barrier
US5330088A · kind A · utility
8Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 30, 1993 |
| Grant date | Jul 19, 1994 |
| Priority date | — |
| Expiry date | Apr 30, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12806
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A layer selected from a group comprising: molybdenum, tantalum, tungsten, osmium, rhenium, ruthenium and an alloy of two or more thereof on the under surface of an electrical contact acts as a barrier to copper diffusion from the braze material into the contact structure. A thin nickel layer on the barrier facilitates the brazing of the barrier coated contact surface to the copper electrodes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.