Process for producing CuCr contact pieces for vacuum switches as well as an appropriate contact piece
US5330702A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 2, 1991 |
| Grant date | Jul 19, 1994 |
| Priority date | — |
| Expiry date | Dec 2, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01H1/0206
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Purely powder-metallurgical processes or sinter-impregnation processes are often used to manufacture CuCr contact materials. Here the aim is to obtain the lowest possible residual porosity, which should be <1%. According to the invention, a powder moulding of the components is densified in two stages; the first stage is a sintering process with a densification of the sintered body to a closed porosity, and the second stage is a hot-isostatic pressing operation (HIP), in which the unencased workpieces are taken to a final density amounting to a space occupation of at least 99%. Thus, an economical method of manufacturing high grade material is obtained. It is possible to produce multi-layer contacts or self-adhesive bonds between the sintered body and a solid substrate, e.g. a copper contact bolt.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.