Printed circuit substrate with projected electrode and connection method
US5330825A · kind A · utility
1Cited by
3References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 24, 1993 |
| Grant date | Jul 19, 1994 |
| Priority date | — |
| Expiry date | Feb 24, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit substrate with projected electrode and a connection method using the same are disclosed. The printed circuit substrate comprises an insulating substrate having formed on one surface or both surfaces thereof an electrically conductive circuit, wherein at least one projected electrode comprising a metallic substance is formed at the side of the end portion of the electrically conductive circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.