Bimodal cured intermixed polymeric networks which are stable at high temperature
US5331018A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 26, 1992 |
| Grant date | Jul 19, 1994 |
| Priority date | — |
| Expiry date | Aug 26, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F283/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention is directed to a non-emissive, bimodal cured polymeric network which has an onset degradation temperature that is about 100.degree. C. above the onset degradation temperature of a base polymer. The novel cured polymeric network comprises the cured reaction product of the following ingredients: (a) combination of one or more liquid carrier monomers or prepolymers which combination is reactive to form a base polymer by exposure to ultraviolet (UV) radiation in the presence of a UV photosensitizer at a temperature, T.sub.uv ; and (b) between about 10 and 100 wt-% based on ingredient (a) of a combination of one or more monomers or prepolymers which combination is reactive to form a cured high temperature stable polymer by heating at a temperature, T.sub..DELTA.. Ingredient (b) is soluble or dispersible in ingredient (a) at a temperature, T.sub.s, wherein T.sub.s is equal to or lower than T.sub.uv, and T.sub.uv is at least about 50.degree. C. lower than T.sub..DELTA..
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.