Hot melt adhesive
US5331033A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 23, 1993 |
| Grant date | Jul 19, 1994 |
| Priority date | — |
| Expiry date | Feb 23, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/04
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
Hot melt packaging adhesive compositions consisting essentially of 20 to 50% by weight of an ethylene n-butyl acrylate copolymer containing 25-45% by weight, preferably 30 to 40% n-butyl acrylate and having a melt index of at least 10; 30 to 60% of an aliphatic or cycloaliphatic hydrocarbon resin or hydrogenated derivative thereof or a hydrogenated aromatic hydrocarbon resin; and 10 to 30% by weight of a high melting synthetic wax provide adhesives characterized by an excellent balance of high and low temperature performance without sacrifice to machinability or thermal stability. Further, the adhesive is characterized by a low density and consequently is readily filterable in recycling systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.