Water-curable, hot melt adhesive composition
US5331049A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 22, 1990 |
| Grant date | Jul 19, 1994 |
| Priority date | — |
| Expiry date | Jun 22, 2010 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/10
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A water-curable hot melt adhesive system is disclosed. The system uses silane hydrolyzable functionality grafted onto an ethylene polymer component, and a tackifier compatible therewith. The ethylene polymer component is a copolymer of ethylene and a hydrocarbyl ester of an .alpha.,.beta.-ethylenically unsaturated carboxylic acid, and the tackifier component provides the adhesive with sufficient silanol condensation catalytic activity to accelerate water curing. The formulation is applied to a substrate surface as a hot melt at a moderate temperature, and subsequently cured by moisture or in a warm water bath. The invention also embodies structural compositions having glass, metallic or leather surfaces adhered with the adhesive and a method for making structural composites.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.