Electronic equipment and computer with heat pipe
US5331510A · kind A · utility
78Cited by
7References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 1992 |
| Grant date | Jul 19, 1994 |
| Priority date | — |
| Expiry date | Aug 28, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
An electronic equipment has heat pipes for radiating heat generated from heat generating electronic parts. The electronic parts are arranged such that electronic parts generating more heat are arranged nearer to a heat radiating portion of each heat pipe to prevent a phenomenon of dryout and radiate the heat efficiently, whereby heat generated from the electronic parts such as LSI chips can be effectively radiated and an excessive rise in temperature of the electronic parts can be suppressed. When the invention is applied to computers, the entire computer size can be reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.