Concave soldering iron tip and method of soldering using same
US5332144A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 17, 1993 |
| Grant date | Jul 26, 1994 |
| Priority date | — |
| Expiry date | Mar 17, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0338
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
In accordance with a preferred embodiment of the present invention, a concavity of an elliptical shape is formed in a chisel-shaped soldering tip to create a reservoir in which a quantity of molten solder is retained by surface tension. In a preferred method of use, the leads of an electronic component and the lands of a circuit board to which they are to be electrically connected are pretreated with flux. The tip, with a blob of solder in its concavity, is drawn along the lead/land region with the blob of molten solder making contact therewith, so that molten solder is wicked into the region, and joints are formed between the leads the lands.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.